Information
Code | MK516 |
Name | Electronic Manufacturing Technology |
Term | 2024-2025 Academic Year |
Semester | . Semester |
Duration (T+A) | 3-0 (T-A) (17 Week) |
ECTS | 6 ECTS |
National Credit | 3 National Credit |
Teaching Language | İngilizce |
Level | Doktora Dersi |
Type | Normal |
Mode of study | Yüz Yüze Öğretim |
Catalog Information Coordinator |
Course Goal / Objective
The production of electronic printed circuit boards is a fundamental subject in the field of mechanical engineering. The main objective of the course is to give techniques and methods related to electronic board manufacturing (printed circuit board-PCB) and assembly (printed circuit board assembly-PCBA).
Course Content
Introduction to printed wiring, Types of printed wiring boards, Surface mount technology, Engineering packaging interconnecting system, Layout and standards, Base materials, Surface mount technology materials, circuit components and hardware, Fabrication; drilling and machining, image transfer and plating, Plating, additive plating, etching, Solder resist, bare board testing, Assembly and test, manual component assembly, Conformal coatings, Testing and rework in eelectronic assembly, Throgh-hole and surface mount Soldering. ,
Course Precondition
none
Resources
Printed Circuits Handbook, Edition 6,Clyde Coombs, McGraw-hill
Notes
Lecture notes and books are sufficient. No other resources are needed.
Course Learning Outcomes
Order | Course Learning Outcomes |
---|---|
LO01 | Knows the product product design rules necessary for economic assembly activities. Can determine the work point for assembly taking into account ergonomic requirements. |
LO02 | Can create assembly-organization forms for manual assembly. |
LO03 | Determine the economic efficiency of various assembly ideas. |
LO04 | Recognize, apply and select the infrastructure modules required for automation of assembly processes. Have knowledge about the design of assembly machines and system. |
Relation with Program Learning Outcome
Order | Type | Program Learning Outcomes | Level |
---|---|---|---|
PLO01 | Bilgi - Kuramsal, Olgusal | Understands and applies basic sciences, mathematics and engineering sciences at a high level. | 5 |
PLO02 | Beceriler - Bilişsel, Uygulamalı | He/she has extensive and in-depth knowledge, including the latest developments in his/her field. | 5 |
PLO03 | Bilgi - Kuramsal, Olgusal | They reach the latest information in a field and have a high level of proficiency in the methods and skills necessary to comprehend and research them. | 4 |
PLO04 | Yetkinlikler - Öğrenme Yetkinliği | They carry out a comprehensive study that brings innovation to science and technology, develops a new scientific method or technological product/process, or applies a known method to a new field. | 3 |
PLO05 | Yetkinlikler - Bağımsız Çalışabilme ve Sorumluluk Alabilme Yetkinliği | Independently perceives, designs, implements and concludes an original research process; manages this process. | 2 |
PLO06 | Yetkinlikler - Alana Özgü Yetkinlik | Contributes to the science and technology literature by publishing the outputs of its academic studies in respected academic environments. | 3 |
PLO07 | Yetkinlikler - İletişim ve Sosyal Yetkinlik | Evaluates scientific, technological, social and cultural developments and conveys them to the society with the awareness of scientific impartiality and ethical responsibility. | 2 |
PLO08 | Belirsiz | Performs critical analysis, synthesis and evaluation of ideas and developments in the field of expertise. | 4 |
PLO09 | Yetkinlikler - Öğrenme Yetkinliği | Communicates effectively, both verbally and in writing, with those working in the field of specialization and the wider scientific and social community, communicating and discussing at an advanced level of written, oral and visual communication using a foreign language at least at the C1 General Level of the European Language Portfolio. | 5 |
PLO10 | Yetkinlikler - Bağımsız Çalışabilme ve Sorumluluk Alabilme Yetkinliği | Carries out literature search |
Week Plan
Week | Topic | Preparation | Methods |
---|---|---|---|
1 | Introduction to printed wiring | Book-Section 1- | Öğretim Yöntemleri: Gösteri, Anlatım, Soru-Cevap, Tartışma |
2 | Types of printed wiring boards. | Book-Chapter 2- | Öğretim Yöntemleri: Anlatım, Soru-Cevap, Tartışma, Gösteri |
3 | Surface mount technology, | Book-Part 3 | Öğretim Yöntemleri: Anlatım, Soru-Cevap, Gösteri, Tartışma |
4 | Engineering packaging interconnecting system | Book-Part 4 | Öğretim Yöntemleri: Anlatım, Soru-Cevap, Gösteri, Tartışma |
5 | Layout and standards | Book-chapter 5 | Ölçme Yöntemleri: Ödev |
6 | Base materials | Book-Chapter 6 | Öğretim Yöntemleri: Anlatım, Soru-Cevap, Gösteri |
7 | Surface mount technology materials, circuit components and hardware | Book-Chapter 7-8 | Öğretim Yöntemleri: Anlatım, Soru-Cevap, Tartışma, Alıştırma ve Uygulama |
8 | Fabrication; drilling and machining, image transfer and plating | Book-chapter 10, 11, 12 | Ölçme Yöntemleri: Ödev |
9 | MIDTERM EXAM | Books | Ölçme Yöntemleri: Sözlü Sınav |
10 | Plating, additive plating, etching | Book-Chapter 13,14 | Öğretim Yöntemleri: Anlatım, Gösteri, Tartışma |
11 | Solder resist, bare board testing. | Book-Chapter 16,17 | Öğretim Yöntemleri: Gösteri |
12 | Assembly and test, manual component assembly | Book-chapter 18-19 | Öğretim Yöntemleri: Anlatım, Soru-Cevap, Alıştırma ve Uygulama, Gösteri |
13 | Conformal coatings. | Book- Chapter 20, | Öğretim Yöntemleri: Gösteri, Anlatım |
14 | Testing and rework in electronic assembly | Book- Chapter 21,22 | Öğretim Yöntemleri: Anlatım, Gösteri, Tartışma |
15 | Throgh-hole and surface mount Soldering, | Book -chapter 23,27 | Öğretim Yöntemleri: Anlatım, Soru-Cevap, Gösteri, Tartışma |
16 | Final Exams | source book and all lecture notes related to the course | Ölçme Yöntemleri: Sözlü Sınav |
17 | Final Exams | source book and all lecture notes related to the course | Ölçme Yöntemleri: Sözlü Sınav |
Student Workload - ECTS
Works | Number | Time (Hour) | Workload (Hour) |
---|---|---|---|
Course Related Works | |||
Class Time (Exam weeks are excluded) | 13 | 3 | 39 |
Out of Class Study (Preliminary Work, Practice) | 13 | 5 | 65 |
Assesment Related Works | |||
Homeworks, Projects, Others | 6 | 5 | 30 |
Mid-term Exams (Written, Oral, etc.) | 1 | 2 | 2 |
Final Exam | 1 | 2 | 2 |
Total Workload (Hour) | 138 | ||
Total Workload / 25 (h) | 5,52 | ||
ECTS | 6 ECTS |